| 摘要 |
PROBLEM TO BE SOLVED: To provide a peripheral exposure device and a semiconductor device for preventing trouble that foreign materials in a resist scattered by a foaming phenomenon is stuck on a chip area. SOLUTION: In a peripheral exposure device 10, a wafer Waf to be treated where a resist film RST is formed on its upper surface is sucked and held by a chuck 12 rotatable with its center as an axis. An optical peripheral exposure system 11 makes appear an exposure spot ES which is converged on an edge area of the wafer Waf to be treated. Besides, a cover 13 faces the wafer Waf to be treated while keeping an interval of several millimeters therewith. In such a case, the cover 13 has an opening 14 except for a portion of the exposure spot ES and its periphery. Thus, exposure light is directly imparted to the edge area of the wafer while rotating the wafer Waf to be treated. Most of foreign materials (resist film pieces) scattered from the resist film in the portion of the exposure spot ES by foaming are stuck on the cover 13. COPYRIGHT: (C)2004,JPO
|
