| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming bumps only by basic printed wiring board manufacturing processes without using conductive paste. SOLUTION: The bump forming method comprises a step (1) for forming a metal plating layer of a copper plating enabled metal other than copper on a surface on which bumps of a copper plating laminated plate 1 are to be formed and forming a thick copper plating layer 3 on the metal plating layer 2, a step (2) for forming through holes 4 on the copper plating laminated plate 1 and forming an inner layer circuit 6 on a surface which acts as an inner layer, a step (3) for laminating the copper plating laminated plate 1 and another copper plating laminated plate 8 through prepreg 7 and forming a multilayer plate by heat pressurization adhesion, a step (4) for etching the thick plating layer, a step (5) for etching the metal plating layer other than copper, and a step (6) for forming through holes 10 on the multilayer plate and forming an outer layer circuit 14. COPYRIGHT: (C)2004,JPO
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