| 摘要 |
PROBLEM TO BE SOLVED: To provide a socket for an electronic component, having high and stable conductivity due to contact with loaded electronic components. SOLUTION: In this socket 10 for an electronic component, each solder ball 64 of a BGA 60 is electrically connected to a second exposed part 30 through an intermediate part 40 by making contact with a first exposed part 20. If the BGA 60 is pressed onto a mounting surface 12a by the pressing protrusion 58 of a pressing part 50, the circular cross section of the first exposed part 20 is elastically deformed by the solder ball 64 and they are reliably brought into contact with each other, and even if the height positions of a plurality of solder balls 64 are not uniform and have a variation of severalμm, the variation is absorbed by the elastic deformation of the first exposed part 20, and all solder balls 64 are brought into contact with the first exposed part 20. As a result, all solder balls of the BGA 60 is electrically connected to the second exposed part 30 from the intermediate part 40 through a gold plated layer 20b of the first exposed part 20. COPYRIGHT: (C)2004,JPO
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