SEMICONDUCTOR CHIP ON WHICH CONDUCTOR TRACKS ON A (1,0,0) CRYSTAL PLANE FORM AN ANGLE OF AT LEAST TEN DEGREES WITH THE (0,1,0) AND (0,0,1) CRYSTAL PLANES IN ORDER TO INCREASE THE FRACTURE RESISTANCE

摘要

Thinned semiconductor chips (1) or semiconductor chip stacks, for application in chipcards, have arrangements of sections of conductor tracks (2) in the (A, B) directions on an (1,0,0) upper surface, which include an angle (6, 7) of at least 10 DEG with the {0,1,0} planes and the {0,0,1} planes of the silicon crystal to increase fracture resistance.