发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To enhance a mounting efficiency of a wiring and to enhance a connection accuracy among the wirings. SOLUTION: Zeroth layer wirings M0a, M0b are disposed along grids y1, y2 extending in a Y direction, and first layer wirings M1a, M1b are disposed along a grid x1 extending in an X direction. When these are electrically connected via connection parts TH0a and TH0b, the connection part TH0b, disposed so as to deviate to a right side by a distance L1 from the intersection of the grids y2, x1, a formation area of reservoirs Ra, Rb is ensured in the first layer wirings M1a, M1b, and a notch (projection part) is provided in the 0-th layer wiring M0b beneath the deviated connection part TH0b. As a result, the distance between the reservoirs can be ensured, to enhance a mounting efficiency of the wiring and to enhance connection accuracy among the wirings. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004111771(A) 申请公布日期 2004.04.08
申请号 JP20020274466 申请日期 2002.09.20
申请人 HITACHI LTD 发明人 MURATA TOMOO;YABUKI SHINOBU;YAMASHITA TAKEO
分类号 H01L21/3205;H01L21/768;H01L21/82;H01L21/822;H01L21/8234;H01L23/52;H01L23/528;H01L27/04;H01L27/088;H01L27/118;(IPC1-7):H01L21/82;H01L21/823;H01L21/320 主分类号 H01L21/3205
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