| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a mounting structure of an IC (integrated circuit) having a QFP (quad flat package) structure, employing a reflow for mounting the IC and capable of inspecting the IC even after fixing a mounting substrate to a casing. <P>SOLUTION: The IC has a structure wherein a square heat releasing hole (10), smaller than the profile size of a package (9) for the IC, is provided on the substrate (2) for mounting the IC (1) having the QFP structure and a gel sheet 3 is arranged on the heat releasing hole, then, the upper surface of the gel sheet is contacted closely to the lower surface of the IC and the lower surface of the gel sheet is contacted closely to a projected heat sink 4 on the casing for fixing the substrate. <P>COPYRIGHT: (C)2004,JPO</p> |
