| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer treating system by which the surface of the board can be stably and reliably dried. SOLUTION: A discharge nozzle 41 and a suction nozzle 42 are fixed near the end of a nozzle arm 43. While the wafer W which has been rinsed by pure water is rotated, the nozzle arm 43 is turned along a locus R and nitrogen gas is discharged from the discharge nozzle 41. At the same time, ambient atmosphere is sucked by the suction nozzle 42. Protuberant and visible moisture is gently removed from the wafer W by spray of nitrogen gas from the discharge nozzle 41. An infinitesimal amount of moisture remaining in microscopic patterns and the like is completely removed by sucking the atmosphere contacting the same region as that on the wafer W from which the moisture is removed. In this way, the region can be completely dried. Consequently, the surface of the wafer W can be stably and reliably dried. COPYRIGHT: (C)2004,JPO
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