发明名称 |
METHOD FOR PRODUCING A COMPONENT HAVING SUBMERGED CONNECTING AREAS |
摘要 |
In order to expose a submerged bondable connecting area in a component comprising at least two substrates that are joined to one another, trenches of a relatively shallow depth are provided on the joining service of the second substrate before the substrates are joined. After joining both substrates, cuts are made opposite the trenches thereby opening the same from the rear side. The cutouts to be removed are defined between two trenches. |
申请公布号 |
WO2004008522(A3) |
申请公布日期 |
2004.04.08 |
申请号 |
WO2003EP05859 |
申请日期 |
2003.06.04 |
申请人 |
AUSTRIAMICROSYSTEMS AG;BRANDL, MANFRED;CSERNICSKA, ROBERT;DRAXLER, WALTER |
发明人 |
BRANDL, MANFRED;CSERNICSKA, ROBERT;DRAXLER, WALTER |
分类号 |
B81B7/00;B81C1/00;H01L21/98 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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