| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the possibility of breaking an IC module or disconnecting the IC module and an antenna when external force is applied to RF-ID media in a bending direction or when external force is applied convergently to the IC module. <P>SOLUTION: The RF-ID media has at least an inlet 10 formed by forming a conductive antenna 12 on a resin sheet 15 and bonding the IC module capable of writing and reading information in a non-contact state through the antenna 12, onto the resin sheet 15 by adhesive resin 16 hardened by applying a prescribed condition. The adhesive resin 16 is provided with a hardened region 16a in a hardened state, and an unhardened region 16b which is not hardened. <P>COPYRIGHT: (C)2004,JPO |
