| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor wafer supporting boat with which a plurality of semiconductor wafers to be heat-treated simultaneously can be treated highly uniformly, and to provide a method of manufacturing a semiconductor device and a semiconductor device. SOLUTION: The boat BT1 for horizontal heat treatment furnace is inserted into a reaction tube not shown in the figure while the boat BT1 is loaded with a prescribed number of semiconductor wafers Waf and subjected to heat treatment together with the wafers Waf. The boat BT1 has quartz-made boat members Q11-Q14 and substantially supports the wafers Waf. Each of the members Q11-Q14 has an arrangement of wafer housing grooves G into which the wafers Waf are guided and is changed in cross-sectional area from one end to the other end. In addition, the thickness T1 of each boat member Q11-Q14 is gradually increased from one end which is first put in the heat treatment furnace to the other end which is later put in the furnace. It is desirable to make the sizes of the wafer housing grooves G1 equal to each other over the whole area of each boat member Q11-Q14. COPYRIGHT: (C)2004,JPO |
