| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, since air bubbles remain in a non-through hole formed in a multiple wiring boards, the inside metallized conductor is not sufficiently pre-treated, and a part which is not coated with any plated metallic layer is not formed. SOLUTION: A ceramic mother board 1 formed with a non-through hole 6b whose inner peripheral face is coated with a metallize conductor 7 is immersed in water solution whose surface tension force ranges from 300 to 600μN/cm by adding anionic surface active agent, and simultaneously impressed with ultrasonic waves so that air bubbles in the non-through hole 6b can be completely removed. Plating pre-treatment is carried out, and the metallize conductor 7 is coated with a plated metallic layer. Thus, plating pre-treatment can be sufficiently applied to the metaillize conductor 7 without being affected by any adverse influence of air bubbles, and the metallize conductor 7 in the non-through hole 6b can be coated with satisfactory plated metallic layers 8 and 9 without any failure. COPYRIGHT: (C)2004,JPO
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