| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that can be improved in the ease of cutting of a thin film resistor with laser light, and to provide a method of manufacturing the device. SOLUTION: For example, a conductive film 10 is formed directly on the thin film resistor 6. The film 10 is formed so that the film 10 may be disposed in the laser-trimmed area of the resistor 6. Therefore, when the laser trimming is performed, the resistor 6 generates heat due to the laser light and, in addition, the conductive film 10 also generates heat by absorbing the laser light in the portion irradiated with the laser light. Since the heat added to the thin film resistor 6 increases, the ease of cutting of the resistor 6 is improved. COPYRIGHT: (C)2004,JPO
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