发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 <p>A substrate processing apparatus stably and efficiently conducts a film-forming process on a substrate (W) to be processed. In the substrate processing apparatus, the substrate (W) to be processed is supported at a position facing a heater portion and a holding member for holding the substrate (W) is rotated, whereby the temperature distribution of the substrate (W) is kept uniform and a warp of the substrate (W) is suppressed. A shaft of the holding member penetrates through the heater portion and is inserted into a ceramic shaft of a rotational drive unit, and the ceramic shaft is supported by a ceramic bearing, thereby enabling to prevent contamination by a metal. The rotational driving force of a motor is transferred to the ceramic shaft via a magnet coupling.</p>
申请公布号 WO2004030063(A1) 申请公布日期 2004.04.08
申请号 WO2003JP12083 申请日期 2003.09.22
申请人 TOKYO ELECTRON LIMITED;HORIGUCHI, TAKAHIRO;KUWAJIMA, RYO 发明人 HORIGUCHI, TAKAHIRO;KUWAJIMA, RYO
分类号 F16C3/02;C23C16/458;C23C16/46;F16C33/32;H01L21/00;H01L21/31;H01L21/316;H01L21/683;H01L21/687;(IPC1-7):H01L21/31;H01L21/68;H01L21/02 主分类号 F16C3/02
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