发明名称 |
SUBSTRATE PROCESSING APPARATUS |
摘要 |
<p>A substrate processing apparatus stably and efficiently conducts a film-forming process on a substrate (W) to be processed. In the substrate processing apparatus, the substrate (W) to be processed is supported at a position facing a heater portion and a holding member for holding the substrate (W) is rotated, whereby the temperature distribution of the substrate (W) is kept uniform and a warp of the substrate (W) is suppressed. A shaft of the holding member penetrates through the heater portion and is inserted into a ceramic shaft of a rotational drive unit, and the ceramic shaft is supported by a ceramic bearing, thereby enabling to prevent contamination by a metal. The rotational driving force of a motor is transferred to the ceramic shaft via a magnet coupling.</p> |
申请公布号 |
WO2004030063(A1) |
申请公布日期 |
2004.04.08 |
申请号 |
WO2003JP12083 |
申请日期 |
2003.09.22 |
申请人 |
TOKYO ELECTRON LIMITED;HORIGUCHI, TAKAHIRO;KUWAJIMA, RYO |
发明人 |
HORIGUCHI, TAKAHIRO;KUWAJIMA, RYO |
分类号 |
F16C3/02;C23C16/458;C23C16/46;F16C33/32;H01L21/00;H01L21/31;H01L21/316;H01L21/683;H01L21/687;(IPC1-7):H01L21/31;H01L21/68;H01L21/02 |
主分类号 |
F16C3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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