| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor module by which joining can be performed in a short time at a low temperature and more highly reliable joints can be obtained by performing joining without using any soldering medium. <P>SOLUTION: This method of manufacturing semiconductor module includes a first joining step of joining a first circuit electrode 31 formed on a circuit board 30 to the rear-side device electrode 11 of a semiconductor element 10, a second joining step of joining the surface-side device electrode 12 of the element 10 to one end of a lead frame 40, and a third joining step of joining the other end of the frame 40 to a second circuit electrode 32 formed on the circuit board 30. Each pair of electrodes to be jointed to each other is joined by respectively solid-liquid diffusing low-melting point metallic layers 20 and 21 into the electrodes by heating and pressurizing the layers 20 and 21 after the layers 20 and 21 are formed on one of the electrodes. <P>COPYRIGHT: (C)2004,JPO |
