| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency circuit for a microwave and millimeter wave band high frequency apparatus for avoiding deterioration in characteristics for high frequencies at a conductor bump connection part of flip-chip mount. SOLUTION: The high frequency circuit is provided with a first dielectric board 1c on the front side of which a first signal line 1a and a grounded conductor wire 1b are formed, and a second dielectric board 1e on the front side of which a second signal line 1d is formed in the arrangement of the boards 1c, 1e opposed to each other, wherein a first input output conductor pad 1f connected to the first signal line and a second input output conductor pad 1g connected to the second signal line are physically and electrically connected to each other via a conductor bump 1h, and the first signal line and the grounded conductor wire are connected by a branch wire 1i. COPYRIGHT: (C)2004,JPO |
