| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer prober which is capable of attracting the entire silicon wafer uniformly without causing damage to the silicon wafer depending on the positions of the tester pins of a probe card. SOLUTION: A porous chuck top conductor layer 2 is formed on a pedestal 3 where through-holes 8 are provided. COPYRIGHT: (C)2004,JPO
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