| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressing device and a method capable of improving the efficiency of operation by eliminating the necessity of redesign and remolding of components for the pressing device. SOLUTION: The pressing device for bending a lead extended from a semiconductor device and electrically connecting the semiconductor device to a substrate so as to form a prescribed shape of the lead is provided with a vertical side die for determining the vertical part of the bending shape of the lead, a horizontal side die for determining the horizontal part of the bending shape of the lead and a punch for bending the lead in cooperation with the vertical die and the horizontal die. COPYRIGHT: (C)2004,JPO
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