发明名称 |
Method for electrochemical fabrication |
摘要 |
An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed. |
申请公布号 |
US2004065552(A1) |
申请公布日期 |
2004.04.08 |
申请号 |
US20030677409 |
申请日期 |
2003.10.01 |
申请人 |
UNIVERSITY OF SOUTHERN CALIFORNIA |
发明人 |
COHEN ADAM L. |
分类号 |
B81C1/00;B21C37/00;C23F1/00;C25D;C25D1/00;C25D1/10;C25D5/02;C25D5/10;C25D7/12;C25D17/06;C25D19/00;C25D21/12;H01L21/288;H05K3/24;(IPC1-7):C25D5/02 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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