THIN SEMICONDUCTOR CHIP MANUFACTURING METHOD

摘要

A method for manufacturing a thin semiconductor chip in which a thin wafer being processed is prevented from breaking, chipping, and warping while stably maintaining the shape of the wafer in the processing steps. The method is characterized in that while one side (1a) of a thin wafer (1) is being processed, the other side (1b) is stuck to a rigid support (2), and a ring frame (3) encompassing the circumference of the thin wafer (1) is stuck to the rigid support (2).