发明名称 POLISHING METHOD, CMP EQUIPMENT, AND FILM THICKNESS MEASURING INSTRUMENT
摘要 <P>PROBLEM TO BE SOLVED: To highly precisely control polishing volume in a polishing method in which polishing is performed by revolving a table equipped with polishing cloth by a motor for polishing a target object. <P>SOLUTION: The overall system is arranged to have a process in which torque current values for the motor during polishing are obtained for each of section (1), section (2), section (3), and section (4), in accordance with each stage of polishing, and another process in which the polishing time for the target object is determined based on a multiple regression formula in which the torque current value for each section is made an explanatory parameter. Also polishing equipment designed to execute these processes is provided. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004106123(A) 申请公布日期 2004.04.08
申请号 JP20020272544 申请日期 2002.09.19
申请人 TOSHIBA CORP 发明人 INO TOMOMI
分类号 B24B49/16;B24B37/013;B24B53/017;B24B53/02;H01L21/304 主分类号 B24B49/16
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