| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a holder of a semiconductor laser fixing apparatus which improves a heat sink for releasing a heat generated from a semiconductor laser to the holder of the fixing apparatus, and which simultaneously does not need to be prepared in response to an outer diameter of the individual laser even when the outer diameter accuracy of the laser is not high. <P>SOLUTION: Many triangular posts 14 are formed along the depth direction of a mounting hole 12 on the inner surface of the hole 12 of a holder 10 having the hole 12 formed to fix a semiconductor laser 16 to reduce a diameter of an envelope circle of its distal end smaller than the outer diameter size of the laser 16 so that the laser 16 is easily inserted under press in the hole 12 of the semiconductor laser fixing apparatus 10. <P>COPYRIGHT: (C)2004,JPO |
