| 发明名称 |
ADHESIVE PROCESSING SHEET AND ITS MANUFACTURING METHOD |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive sheet for use in processing a product such as a semiconductor wafer and the like and its manufacturing method, capable of minimizing warping of the product due to stresses remaining in the sheet without damaging the wafer on peeling the sheet apart. <P>SOLUTION: The adhesive processing sheet is provided with an adhesive layer on one surface of a support body which is not lower than 15N/mm<SP>2</SP>and not greater than 250N/mm<SP>2</SP>in bending modulus when a slender sheet with a width of 20mm is bent at 3.0mm of a radius of curvature. The support body is preferably a laminate having a composite film containing a urethane polymer and a vinyl polymer as active ingredients. <P>COPYRIGHT: (C)2004,JPO |
| 申请公布号 |
JP2004106515(A) |
申请公布日期 |
2004.04.08 |
| 申请号 |
JP20030201557 |
申请日期 |
2003.07.25 |
| 申请人 |
NITTO DENKO CORP |
发明人 |
YOSHIDA YOSHITOKU;MAENO YOHEI;AKAZAWA MITSUHARU;MATSUMURA TAKESHI;TAKAHASHI TOMOKAZU |
| 分类号 |
B24B37/30;B32B27/00;B32B27/30;C09J4/00;C09J7/02;C09J201/00;H01L21/301;H01L21/304 |
主分类号 |
B24B37/30 |
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