JIG FOR BAKING ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To efficiently bake an electronic component by enhancing degassing of a gas generated from a binder when baking the electronic component and preventing the electronic component from reacting with a zirconia surface layer by retaining a moderate surface roughness of the zirconia surface layer.

SOLUTION: The jig for baking the electronic component comprises a substrate whose surface is covered with an intermediate layer and the zirconia surface layer formed on the intermediate layer. The zirconia surface layer has a surface roughness in terms of a center surface average roughness Sa of 10-40 μm.

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