发明名称 METHOD OF FORMING INTEGRATED CIRCUIT INCLUDING ANTI-FUSE AND INTEGRATED CIRCUIT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide the structure and the method of forming an integrated circuit including a low programming voltage anti-fuse on a semiconductor substrate. <P>SOLUTION: This integrated circuit is formed by doping a part of a semiconductor substrate with nitrogen and a charge carrier dopant source, forming a thin dielectric that is destroyed by the application of breakdown voltage on the doped portion of the semiconductor substrate, forming a first conductor that is separated from the semiconductor substrate by the thin dielectric, and forming a second conductor that is conductively connected with the doped portion of the semiconductor substrate. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004111957(A) 申请公布日期 2004.04.08
申请号 JP20030310635 申请日期 2003.09.02
申请人 INTERNATL BUSINESS MACH CORP <IBM> 发明人 CHIDAMBARRAO DURESETI;FREY ULRICH;HEGDE SURYANARAYAN G;TONTI WILLIAM R
分类号 H01L21/82;H01L23/525;H01L27/10;(IPC1-7):H01L21/82 主分类号 H01L21/82
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