| 摘要 |
PURPOSE: A carrier module is provided to support stably the bottom face of a semiconductor device and grip a side of the semiconductor device to connect leads or balls of the semiconductor device to a test socket of a test site by using the first and the second latches. CONSTITUTION: A carrier module includes a carrier module body(110), a semiconductor loading part(115), the first latches(140), the second latches(150), and the first and the second elastic members. The semiconductor loading part(115) is installed at a center part of the carrier module body(110). The first latches(140) face each other to support the bottom face of the semiconductor device. The second latches(150) are installed at both sides of the first latches. The second latches(150) face each other to grip a side of the semiconductor device. The first and the second elastic members are used for supporting elastically the first and the second latches(140,150).
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