| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a piezoelectric device, a manufacturing method for a piezoelectric vibrating piece of the same, a mobile phone device using the same, and an electronics device using the same which can prevent short-circuited electrodes effectively in a bonding structure of a piezoelectric vibrating piece and electrodes in a package without degrading the impact resistance. <P>SOLUTION: This device is such a piezoelectric device that the piezoelectric vibrating piece is fixed in a cantilever manner by housing the piezoelectric vibrating piece 32 in an internal space of the package 36, and by bonding the electrodes provided inside the package and extraction electrodes 71, 71 of the piezoelectric vibrating piece by using a conductive adhesive agent. The electrodes on the package side are the electrode sections 31, 31 formed on both sides in the width direction of the inside bottom of the package, respectively. The extraction electrodes 71, 71 are provided on both sides in the width direction of the base portion of the piezoelectric vibrating piece, respectively. A groove portion 55 or a protruding portion is provided between the lead-out electrodes with respect to at least the surface facing the electrodes at the package side of the extraction electrodes. <P>COPYRIGHT: (C)2004,JPO |
