CIRCUIT BOARD, ITS MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a circuit board that can suppress component cost to a low level while securing the number of inter-chip wiring by reducing the size of a semiconductor substrate used for connecting the semiconductor chips to each other, and to provide a method of manufacturing the circuit board, a semiconductor device, and a method of manufacturing the semiconductor device.

SOLUTION: The circuit board 1 is provided with inter-chip wiring 15 used for connecting a plurality of semiconductor chips 2 and 3 to each other and external wiring 13 used for connecting the chips 2 and 3 to external circuits. The board 1 is composed of an insulating substrate 5 provided with the external wiring 13 on its first surface 5a side and a semiconductor substrate 7 which is embedded in the central part of one main surface of the insulating substrate 5 and provided with the inter-chip wiring 15 on its surface exposed on the first surface 5a side of the substrate 5. The first surface 5a of the insulating substrate 5 and the surface of the semiconductor substrate 7 on which the inter-chip wiring 15 is formed are arranged in the same plane.

COPYRIGHT: (C)2004,JPO