| 摘要 |
PROBLEM TO BE SOLVED: To provide a copolyamide resin composition comprising a copolyamide and apatite. SOLUTION: The copolyamide resin composition comprises 100pts.wt. (A) copolyamide comprising 90-99.9wt.% polyamide 66 (hexamethylene adipamide) units and 0.1-10wt.% polyamide 6 units and end-blocked with 1-70 (millieq/Kg) of a monocarboxylic acid or a monoamine, 0.1-30pts.wt. (B) apatite, and 0.01-1pt.wt. (C) at least one moldability improver selected from a higher fatty acid metal salt, a higher fatty acid ester, and a higher fatty acid amide compound. This composition is excellent in moldability such as desirable moldability and melt viscosity stability in molding and decrease in staining of a mold caused by thermal decomposition components when used to give industrial materials such as various machine industry parts and electrical and electronic components and gives a molding excellent in strengths, rigidity, flexibility and appearance and excellent in weathering resistance, rigidity on water absorption, and roundness. COPYRIGHT: (C)2004,JPO |
