| 摘要 |
PROBLEM TO BE SOLVED: To detect an alignment mark formed on a wafer with high accuracy. SOLUTION: A position detecting method comprises a step S51 for setting up signal processing, a step S53 for acquiring image information on an alignment mark from an alignment detection optical system and calculating, a step S54 for calculating a misalignment volume through the signal processing set up at the step S51 from the image information as to the alignment mark acquired at the step S53, a step S57 for obtaining a combination of a shot (positional information) and the signal processing to make a residual error Ri minimum, a step S58 for positioning a wafer in a projection optical system by the use of a wafer stage on the basis of an AGA parameter calculated under the condition of combination that the residual error Ri becomes minimum, and a step S59 for transferring a pattern on a reticle onto a wafer for exposure. COPYRIGHT: (C)2004,JPO |
