| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wafer manufacturing method capable of effectively removing oil, chips, abrasive particle and the like which are stuck to a wafer after cutting the wafer with a wire saw to be capable of reducing a time and a cost which are required for production of the wafer. <P>SOLUTION: A plurality of slits 109 are formed on a bottom surface of a groove 103 by providing the groove 103 on a semiconductor ingot to cut with the wire saw. The wafer 44 which is cut and suspended by being ranged in a fence state from the carbon slicing base 101 is installed to a wafer cleaning apparatus and cleaning liquid is injected from a nozzle provided above the groove 103. Since cleaning of a wafer upper part which is conventionally difficult can be effectively carried out and a post process is enabled to be omitted, the time and the cost which are required for manufacturing the wafer can be reduced. <P>COPYRIGHT: (C)2004,JPO</p> |
