发明名称 SUBSTRATE TREATMENT DEVICE, TREATMENT SYSTEM, AND SUBSTRATE TREATMENT METHOD
摘要 PROBLEM TO BE SOLVED: To provide substrate treatment device, treatment system, and substrate treatment method which can prevent a mix of treatment liquids on a front surface of a nozzle, without using a double-chamber structure. SOLUTION: The substrate treatment equipment comprises a chamber 100, which stores a plurality of substrates W in line, and two or more nozzles 123 which discharge different treatment liquids. The substrates W are supplied with the treatment liquids from the nozzles 123 and are treated by the treatment liquids. Each of the nozzles 123 is moved along the substrate arrangement direction to be moved inside and outside the chamber 100. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004111735(A) 申请公布日期 2004.04.08
申请号 JP20020273622 申请日期 2002.09.19
申请人 TOKYO ELECTRON LTD 发明人 KAMIKAWA YUJI
分类号 G03F7/42;H01L21/027;H01L21/304;(IPC1-7):H01L21/304 主分类号 G03F7/42
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