发明名称 Process for applying a coating to untreated metal substrates
摘要 An improved process for applying a coating by means other than electrodeposition to an untreated ferrous metal substrate is disclosed. The substrate need not be phosphated prior to treatment. The process includes contacting the substrate surface with a Group IIIB and/or IVB metal-containing compound in a medium that is essentially free of accelerators, phosphate, zinc, and polymeric material, and coating the substrate by non-electrolytic means. This composition is then cured by conventional means. Substrates treated by the process of the present invention demonstrate excellent corrosion resistance and are also disclosed herein.
申请公布号 US2004067313(A1) 申请公布日期 2004.04.08
申请号 US20020263517 申请日期 2002.10.03
申请人 HAUSER BRIAN T. 发明人 HAUSER BRIAN T.
分类号 B05D3/10;B05D7/00;B05D7/14;C23C22/34;(IPC1-7):B05D3/10;B05D1/18 主分类号 B05D3/10
代理机构 代理人
主权项
地址