发明名称 |
METHOD AND APPARATUS FOR AN IMPROVED UPPER ELECTRODE PLATE IN A PLASMA PROCESSING SYSTEM |
摘要 |
The present invention presents an improved upper electrode for a plasma processing system, wherein the design and fabrication of an electrode plate coupled to an upper assembly advantageously provides gas injection of a process gas with substantially minimal erosion of the electrode plate. |
申请公布号 |
WO2004030011(A2) |
申请公布日期 |
2004.04.08 |
申请号 |
WO2003IB04666 |
申请日期 |
2003.09.29 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
SAIGUSA, HIDEHITO;TAKASE, TAIRA;MITSUHASHI, KOUJI;NAKAYAMA, HIROYUKI |
分类号 |
H01J37/32 |
主分类号 |
H01J37/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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