PASTE FOR CONNECTION OF CIRCUITS AND ANISOTROPIC CONDUCTIVE PASTE HAVING EXCELLENT SHELF STABILITY, COATABILITY, RELIABILITY AND REPAIRABILITY, AND USE THEREOF

摘要

PURPOSE: Provided are a paste for the connection of circuits and an anisotropic conductive paste, which have excellent shelf stability, dispenser coatability and repairability, and show high reliability in adhesion and connection even under high temperature and humidity in their cured state. CONSTITUTION: The paste for the connection of circuits comprises: (I) 30-80 wt% of an epoxy resin; (II) 10-50 wt% of a curing agent selected from the group consisting of an acid anhydride-based curing agent(IIA) and a phenol-based curing agent(IIB); and (III) 5-25 wt% of microparticles having high softening point. The anisotropic conductive paste further comprises (IV) 0.1-25 wt% of conductive particles in addition to the above components (I) to (III).