POLISHING PAD, LAP HOLE COVER, POLISHING DEVICE, POLISHING METHOD, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide: a polishing pad with a window having less scratch at its substrate surface and optically measuring a polishing state excellently during polishing, or a lap hole cover; a polishing device provided with the polishing pad with window or provided with the lap hole cover; a method of manufacturing a semiconductor device; and a polishing method.

SOLUTION: This polishing pad comprises: a polishing layer; and a light transmitting window member for optically measuring the polishing state, in at an opening part formed to a part of the polishing layer. In this polishing pad, a pushing distortion amount at applying a constant load to an almost entire surface of an upper surface at the light transmitting window member is larger than a pushing distortion amount at applying the same constant weight to the same area at an upper surface in the polishing layer part.

COPYRIGHT: (C)2004,JPO