发明名称 METHOD FOR BONDING METAL
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a method for bonding a plurality of dissimilar metals without producing any brittle intermetallic compound on a bonding interface. <P>SOLUTION: In a method for bonding dissimilar materials, energy is given to one material 2 by using a probe 1 rotating at high speed, the material 2 is softened by the friction heat and plastically fluidized, and the material 2 is filled into a recess 4 formed in the other material 3 in advance by pushing or moving the probe, and thus the dissimilar materials are bonded to each other. Since only the material 2 is plastically fluidized, but the material 3 is not plastically fluidized, the materials 2 and 3 are not mixed with each other, and production of any intermetallic compound on the bonded interface can be suppressed. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004106037(A) 申请公布日期 2004.04.08
申请号 JP20020274252 申请日期 2002.09.20
申请人 HITACHI LTD 发明人 OKAMOTO KAZUTAKA;HIRANO SATOSHI;INAGAKI MASATOSHI;AONO YASUHISA
分类号 B23K20/12;B23K20/227;B23K103/20;(IPC1-7):B23K20/12 主分类号 B23K20/12
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