SYSTEM AND PROCESS FOR PRODUCING FLEXIBLE PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a system and a process for producing a flexible printed wiring board in which a thin film of a metal or an alloy exhibiting excellent adhesion strength to a substrate can be formed utilizing an ion beam. SOLUTION: Substrate temperature can be controlled in a surface treatment process and an evaporation process having an adverse effect on the adhesion strength between a resin board and a metal or an alloy utilizing a tubular rotary sample holder capable of mounting a substrate on the side face and feeding cooling water into the tube. Significantly uniform ion irradiation of a large area with ions can be effected using an ion source having a slit-like ion irradiation opening. Furthermore, a flexible printed wiring board can be produced using a small scale system shown on the drawing. COPYRIGHT: (C)2004,JPO