| 摘要 |
PROBLEM TO BE SOLVED: To eliminate occurrence of a fault in conveying, etc. later when a semiconductor wafer is ground to be formed to a thickness as its rigidity is lowered and to make a finishing thickness of the wafer uniform. SOLUTION: The semiconductor wafer is fixed to a support substrate. Before the wafer is ground, a thickness recognizing means 15 recognizes the thickness of the substrate, a control means 42 obtains grinding conditions based on the recognized thickness of the substrate and controls grinding means 19, 31 based on the conditions to grind the wafer. Thus, even when the thickness of the substrate is uneven, the thickness of the wafer can be accurately and uniformly finished. COPYRIGHT: (C)2004,JPO
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