发明名称 THIN FILM-FORMING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a thin film-forming apparatus for forming an organic thin film having uniform film-thickness distribution without being affected by heat from an evaporation source. SOLUTION: The thin film-forming apparatus has a vacuum chamber 2, an evaporation source 3 for an organic material arranged in the vacuum chamber 2, and a partition part 7 for partitioning a space between the substrate 5 and the source 3. An aperture 70 with a slim shape for limiting a vapor-depositing area on the substrate 5 is arranged in the partition part 7. The aperture 70 is formed so as to have a smaller width in its central part than in its end part. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004107764(A) 申请公布日期 2004.04.08
申请号 JP20020274515 申请日期 2002.09.20
申请人 ULVAC JAPAN LTD 发明人 NEGISHI TOSHIO
分类号 H05B33/10;C23C14/24;H01L51/50;H05B33/14;(IPC1-7):C23C14/24 主分类号 H05B33/10
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