发明名称 |
METHOD OF MACHINING TERMINAL BOARD |
摘要 |
<p>A terminal board provided with a plurality of terminals on which ball electrodes are to be formed, wherein after a plurality of terminals (4) are allowed to protrude from the surface of a board (2) covered with a resist film, the board (2) is held on a rotatable chuck table (17) with the resist film kept intact, and a cutter (19) is applied to the resist film-covered surface with the chuck table (17) kept rotated to machine a plurality of terminals (4), whereby machining is done efficiently and economically without shorting terminals to each other when the top of the terminal board where a plurality of terminals protrude in a very close manner such as an interposer (1) is adjusted to be uniform in height.</p> |
申请公布号 |
WO2004030095(A1) |
申请公布日期 |
2004.04.08 |
申请号 |
WO2003JP10512 |
申请日期 |
2003.08.20 |
申请人 |
DISCO CORPORATION;ARAI, KAZUHISA;SANDO, HIDEYUKI |
发明人 |
ARAI, KAZUHISA;SANDO, HIDEYUKI |
分类号 |
H01L23/32;H01L23/498;(IPC1-7):H01L23/32 |
主分类号 |
H01L23/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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