发明名称 WAFER CHUCK ASSEMBLY OF CVD EQUIPMENT
摘要 PURPOSE: A wafer chuck assembly of CVD equipment is provided to load stably a wafer on a chuck by preventing a falling effect of the wafer into the chuck due to the mis-alignment of a flat zone of the wafer. CONSTITUTION: A wafer chuck assembly of CVD equipment includes a chuck(200) and a plurality of chuck pins(300). A wafer(100) induced into a chamber for performing a chemical vapor deposition reaction is loaded on the chuck(200). The chuck pins(300) are projected to an upper portion of the chuck(200) in order to guide the wafer on an upper surface of the chuck(200). The chuck pins(300) are spread from a peripheral part of an opposite edge to a flat zone of the wafer(100) to a side part of the wafer(100).
申请公布号 KR20040029529(A) 申请公布日期 2004.04.08
申请号 KR20020059828 申请日期 2002.10.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, HAK YEONG
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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