| 摘要 |
A plastic molded type semiconductor device has a semiconductor element with electrodes on a surface of the semiconductor element; an adhesive tape on the semiconductor element surface in a state in which the electrodes are being exposed; leads fixed onto the tape; conductive wires for respectively electrically connecting the leads and the electrodes; and a mold resin for sealing parts of the leads, the electrodes and the conductive wires. A plastic molded type semiconductor device comprises a semiconductor element (2) having electrodes provided on a surface of the semiconductor element; an adhesive tape (3) formed on the surface of the semiconductor element in a state in which the electrodes are being exposed; leads (6) fixed onto the adhesive tape and extending to the neighborhoods of the electrodes through their portions being in the direction of the electrodes; conductive wires (5) for respectively electrically connecting the leads and the electrodes; and a mold resin (7) for sealing parts of the leads, the electrodes and the conductive wires so that portions of the leads, each corresponding to a portion on the adhesive tape, are exposed. An independent claim is also included for a method of manufacturing the plastic molded type semiconductor device, comprising preparing a lead frame body made of an adhesive tape, which is shaped in the form of a frame having an outer shape larger than that of the surface with the leads connected to the surface and whose shape of opening is smaller than the outer shape of the lead connecting surface, and leads having parts bonded to an inner edge of the adhesive tape and the remaining parts disposed to enter into the opening. The adhesive tape has an adhesive layer provided on a lead bonding surface of the tape to extend from the inner edge to a lead bonding position and an adhesive layer provided on a surface opposite to the lead bonding surface to extend from the inner edge to a position where the same shape as that formed by an outer edge of the lead connecting surface of the semiconductor element is formed. The lead frame body is placed on the surface of the semiconductor element in a manner that the adhesive layer provided on the surface opposite to the lead bonding surface of the tape coincides in the outer edge with the lead connecting surface of the semiconductor element. The leads are fixed onto the semiconductor element by the adhesive tape. The leads fixed onto the semiconductor element are connected to the semiconductor element by gold wires of the semiconductor device. The mold resin is injected into only the lead connecting surface of the semiconductor element within a mold. The lead connecting surface is covered with the mold resin such that only upper surface portions (6b) of the leads are exposed. The remaining parts of the leads are sealed. |
