Method of manufacturing the circuit device and circuit device

摘要

After a trench 54 is formed in a first conductive foil 60A, the circuit elements are mounted, and the insulating resin is applied on the laminated conductive foil 60 as the support substrate. After being inverted, a second conductive foil 60B is etched on the insulating resin 50 as the support substrate for separation into the conductive paths. Accordingly, it is possible to fabricate the circuit device in which the conductive paths 51 and the circuit elements 52 are supported by the insulating resin 50, without the use of the support substrate. And the interconnects L1 to L3 for the circuit are formed, and can be prevented from slipping because of the curved structure and a visor 58.