Semiconductor module and plate-shaped lead

摘要

A semiconductor module has a substrate; a semiconductor device mounted on the substrate, and having opposite surfaces and electrodes; and a plate-shaped lead having an electrode joint joined to the electrodes, a wiring joint joined to a wiring unit outside the semiconductor device, and a connector connecting the electrode and wiring joints. The electrode joint has a high thermal conductor, and a low expander in the high thermal conductor. A semiconductor module comprises a substrate (10); a semiconductor device (20) mounted on the substrate, and having opposite surfaces and electrodes (22, 23); and a plate-shaped lead (30) having an electrode joint (31) joined to the electrodes, a wiring joint (32) joined to a wiring unit disposed outside the semiconductor device, and a connector (33) connecting the electrode joint and the wiring joint. One of the opposite surfaces is disposed on the substrate. The electrodes are disposed on the other one of the opposite surfaces. At least the electrode joint comprises a high thermal conductor, and a low expander disposed in the high thermal conductor.