发明名称 |
SUBSTRATE POLISHING MACHINE |
摘要 |
There is provided a substrate polishing machine which comprises a polishing surface and a substrate carrier for holding a substrate and bringing it into contact with the polishing surface. The substrate carrier comprises a carrier body, a substrate holding member for holding a substrate with a surface of the substrate to be polished being directed towards the polishing surface. The substrate holding member is mounted on the carrier body in such a manner that the substrate holding member is movable both towards and away from the polishing surface. The substrate polishing machine further comprises a substrate holding member positioning device provided on a side of the substrate holding member opposite to that used for holding the substrate. The substrate holding member positioning device has a flexible member which defines a chamber, and which, upon introduction of a non-compressible fluid, is expanded in a direction towards the polishing surface. |
申请公布号 |
EP1404487(A1) |
申请公布日期 |
2004.04.07 |
申请号 |
EP20020745895 |
申请日期 |
2002.07.10 |
申请人 |
EBARA CORPORATION |
发明人 |
TOGAWA, TETSUJI;NOJI, IKUTARO;NAMIKI, KEISUKE;YASUDA, HOZUMI;KOJIMA, SHUNICHIRO;SAKURAI, KUNIHIKO;TAKADA, NOBUYUKI;NABEYA, OSAMU;FUKUSHIMA, MAKOTO;TAKAYANAGI, HIDEKI |
分类号 |
B24B37/00;B24B37/005;B24B37/04;B24B37/30;B24B41/06;H01L21/304;(IPC1-7):B24B37/04 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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