| 摘要 |
The present invention is directed to a semiconductor device and a semiconductor module both having an inexpensive and compact structure. The semiconductor module (M 1 ) according to a first embodiment of the present invention is comprised of a plurality of semiconductor devices (A 1 ) through (A 3 ) having a structure that includes external connection electrodes ( 15 ) and ( 16 ) being provided on both the face side and the back side of outer peripheral portions of a printed wiring board ( 10 ), and a semiconductor integrated circuit chip ( 1 A) being mounted on a central portion of the printed wiring board ( 10 ). The external connection electrodes ( 15 ) of the semiconductor devices (A 1 ) and (A 3 ) and the external connection electrodes ( 16 ) of the semiconductor device (A 2 ) are electrically connected to each other by solder Sb, for example, either directly or through a chip part ( 30 ) or a relay board ( 40 ). |
