| 发明名称 |
High-density interconnection of temperature sensitive electronic devices |
| 摘要 |
Techniques for interconnecting high-density, structures that include temperature sensitive materials such as piezoelectric ultrasonic transducer arrays, optical detector arrays, MEMS and the like to other structures (e.g., integrated circuits or mechanical assemblies) are disclosed.
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| 申请公布号 |
US6716669(B2) |
申请公布日期 |
2004.04.06 |
| 申请号 |
US20020284999 |
申请日期 |
2002.10.31 |
| 申请人 |
BAE SYSTEMS INFORMATION AND ELECTRONIC SYSTEMS INTEGRATION INC |
发明人 |
ERIKSON KENNETH R.;MARCINIEC JOHN W. |
| 分类号 |
H01L25/18;B81B7/00;H01L21/48;H01L21/60;H01L25/065;H01L25/07;(IPC1-7):H01L21/44;H01L21/50 |
主分类号 |
H01L25/18 |
| 代理机构 |
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