发明名称 |
Composite multilayered ceramic board and manufacturing method thereof |
摘要 |
A composite multilayered ceramic board includes a multilayered ceramic board made of dielectric ceramics, a multilayered ceramic board made of magnetic ceramics and an adhesive layer made of thermosetting resin such as polyimide and the like. In this composite multilayered ceramic board, the dielectric multilayered ceramic board and the magnetic multilayered ceramic board are joined through the adhesive layer.
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申请公布号 |
US6717794(B2) |
申请公布日期 |
2004.04.06 |
申请号 |
US20010029223 |
申请日期 |
2001.12.28 |
申请人 |
SANYO ELECTRIC CO., LTD. |
发明人 |
YOSHIKAWA HIDEKI;TAKAHASHI SEIICHIROU |
分类号 |
B32B18/00;H05K1/03;H05K1/16;H05K3/38;H05K3/46;(IPC1-7):H01K1/14 |
主分类号 |
B32B18/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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