发明名称 |
Plating method and apparatus |
摘要 |
The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.
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申请公布号 |
US6716332(B1) |
申请公布日期 |
2004.04.06 |
申请号 |
US20000582919 |
申请日期 |
2000.07.07 |
申请人 |
EBARA CORPORATION |
发明人 |
YOSHIOKA JUNICHIRO;SAITO NOBUTOSHI;TOKUOKA TSUYOSHI |
分类号 |
C23C18/16;C25D5/00;C25D21/00;C25D21/04;H05K3/18;H05K3/42;(IPC1-7):C25D21/00 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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