发明名称 |
Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same |
摘要 |
A new semiconductor packaging technology is proposed for the fabrication of a thermally-enhanced stacked-die BGA (Ball Grid Array) semiconductor package. By the proposed semiconductor packaging technology, a substrate is used as a chip carrier for the mounting of two semiconductor chips in conjunction with a heat spreader thereon, wherein the first semiconductor chip is mounted over the substrate through flip-chip (FC) technology; the heat spreader is mounted over the first semiconductor chip and supported on the substrate; and the second semiconductor chip is mounted on the heat spreader and electrically coupled to the substrate through wire-bonding (WB) technology. To facilitate the wire-bonding process, the heat spreader is formed with a plurality of wire-routing openings to allow the bonding wires to be routed therethrough. Since chip-produced heat during operation can be dissipated through the heat spreader, it allows an enhanced heat-dissipation efficiency. In addition, the heat spreader can serve as a grounding plane to the package chips, so that the packaged chips would have better electrical performance during operation.
|
申请公布号 |
US6716676(B2) |
申请公布日期 |
2004.04.06 |
申请号 |
US20020251171 |
申请日期 |
2002.09.19 |
申请人 |
SILICONWARE PRECISION INDUSTRIES CO., LTD. |
发明人 |
CHEN EING-CHIEH;LAI CHENG-YUAN;TIEN TZU-YI |
分类号 |
H01L23/31;H01L23/433;H01L25/065;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/31 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|